Resin bond application: Application Materials: Alloy, ceramic, semiconductor, optical, glass, grinding, magnetic materials, metal materials (1) ceramic materials: alumina, Zirconia, silicon carbide, carborundum, Boron nitride, black ceramics, glass; (2) abrasive materials: Refractory, super-essential Oil Stone; (3) magnetic materials: magnetic core, magnetic sheet, magnetic ring, permanent ferrite, Rare Earth Nd-fe-b; (4) Alloy Materials: High Speed Steel, Die Steel, Alloy Steel, stainless steel; (5) Brittle Metal Material: YG series carbide, tungsten steel round bar. (6) List of semiconductor materials: Silicon Carbide, silicon wafer, monocrystalline silicon, polycrystalline silicon, solar cell (7) optical materials: LED, LCD, quartz photovoltaic. Advantages: (1) sharp cutting, high processing efficiency; (2) high rigidity, high strength, Long Service Life; (3) high precision, can be used for precision slotting machine cut, the incision smooth without collapse; (4) continuous cutting without slipping; (5) cutting seam narrow, can greatly improve the utilization rate of precious raw materials.